Product
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Special Working & Engineering 
Special Working & Engineering Grindstone Laser Blade
- Description
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- Very soft cut & chip-free with rounded diagonal segment in both edges
- Special good bond in higher diamond concentration allows to cut it perfectly well
- Application
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Grindstone
- Specification
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Dia. 10"(250mm)/12"(300mm)/14"(350mm) available
1.7/1.9mm thick available
69, Dorim-ri, Ipjang-myeon, Seobuk-gu, Cheonan-city, Chungnam-province, South Korea
Tel : 82-41-587-5600 / 82-70-8240-8895 [English] / 82-70-8240-8896 [Japanese]
E-mail : djdiamond@djdns.co.kr / djdiamond98@daum.net
COPYRIGHT(C) DAEJIN DIAMOND CO., LTD. ALL RIGHTS RESERVED.
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